MicroElectro mechanical devices are often made from a plastic/glass/silicon/silicone layer covered by additional layers. The sealing strength between the layers could be critical to the performance of the device.
Although the bonding approaches used in micro fabrication foundries are powerful, they might not be appropriate for the larger volume production of your device for various reasons. This could pose a bottleneck to the production of your micro device.
We select appropriate scalable processes for bonding which best fit your device’s important surface requirements such as contact angle, chemical/solvent or biological contaminants, inhibitory agents, roughness, or optical/fluorescence issues.